CVE-2026-8676
Awaiting Analysis Awaiting Analysis - Queue
Bluetooth LE Bond Downgrade Vulnerability

Publication date: 2026-05-26

Last updated on: 2026-05-26

Assigner: Silicon Graphics (SGI)

Description
An attacker is able to downgrade the security of a Bluetooth LE connection by deleting an existing bond, spoofing the bonded device and creating a new bond.
CVSS Scores
EPSS Scores
Probability:
Percentile:
Meta Information
Published
2026-05-26
Last Modified
2026-05-26
Generated
2026-06-16
AI Q&A
2026-05-27
EPSS Evaluated
2026-06-14
NVD
CVE-2026-8676
Affected Vendors & Products
Currently, no data is known.
Helpful Resources
Exploitability
CWE
CWE Icon
KEV
KEV Icon
CWE ID Description
CWE-290 This attack-focused weakness is caused by incorrectly implemented authentication schemes that are subject to spoofing attacks.
Attack-Flow Graph
AI Quick Actions
Instant insights powered by AI
Executive Summary

This vulnerability allows an attacker to reduce the security level of a Bluetooth Low Energy (LE) connection by deleting an existing bond between devices, impersonating the bonded device, and then creating a new bond.

Impact Analysis

The impact of this vulnerability is significant as it can lead to a complete compromise of confidentiality, integrity, and availability of the Bluetooth LE connection.

Chat Assistant
Ask questions about this CVE
Hi! I’m here to help you understand CVE-2026-8676. Ask me anything about the vulnerability, its impact, or mitigation strategies.
0/70
EPSS Chart