Bluetooth LE Bond Downgrade Vulnerability

Publication date: 2026-05-26

Last updated on: 2026-05-26

Assigner: Silicon Graphics (SGI)

Description

An attacker is able to downgrade the security of a Bluetooth LE connection by deleting an existing bond, spoofing the bonded device and creating a new bond.

CVSS Scores

EPSS Scores

Probability:
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Meta Information

Published

2026-05-26

Last Modified

2026-05-26

Generated

2026-07-06

AI Q&A

2026-05-27

EPSS Evaluated

2026-07-04

NVD

CVE-2026-8676

Affected Vendors & Products

Currently, no data is known.

Helpful Resources

Exploitability

CWE

KEV

CWE ID	Description
CWE-290	This attack-focused weakness is caused by incorrectly implemented authentication schemes that are subject to spoofing attacks.

Attack-Flow Graph

Impact Analysis

The impact of this vulnerability is significant as it can lead to a complete compromise of confidentiality, integrity, and availability of the Bluetooth LE connection.

Executive Summary

This vulnerability allows an attacker to reduce the security level of a Bluetooth Low Energy (LE) connection by deleting an existing bond between devices, impersonating the bonded device, and then creating a new bond.

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