CVE-2026-8676
Received
Received - Intake
Bluetooth LE Bond Downgrade Vulnerability
Publication date: 2026-05-26
Last updated on: 2026-05-26
Assigner: Silicon Graphics (SGI)
Description
Description
An attacker is able to downgrade the security of a Bluetooth LE connection by deleting an existing bond, spoofing the bonded device and creating a new bond.
CVSS Scores
EPSS Scores
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Meta Information
Affected Vendors & Products
Currently, no data is known.
Helpful Resources
Exploitability
CWE
KEV
| CWE ID | Description |
|---|---|
| CWE-290 | This attack-focused weakness is caused by incorrectly implemented authentication schemes that are subject to spoofing attacks. |
Attack-Flow Graph
AI Powered Q&A
How can this vulnerability impact me? :
The impact of this vulnerability is significant as it can lead to a complete compromise of confidentiality, integrity, and availability of the Bluetooth LE connection.
Can you explain this vulnerability to me?
This vulnerability allows an attacker to reduce the security level of a Bluetooth Low Energy (LE) connection by deleting an existing bond between devices, impersonating the bonded device, and then creating a new bond.
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