CVE-2026-0045
Received Received - Intake
Bluetooth Bonding Bypass in Android BTA

Publication date: 2026-06-01

Last updated on: 2026-06-01

Assigner: Android (associated with Google Inc. or Open Handset Alliance)

Description
In bta_jv_rfcomm_connect of bta_jv_act.cc, there is a possible bypass of bonding for a secure connection due to a logic error in the code. This could lead to local escalation of privilege with no additional execution privileges needed. User interaction is not needed for exploitation.
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Meta Information
Published
2026-06-01
Last Modified
2026-06-01
Generated
2026-06-02
AI Q&A
2026-06-02
EPSS Evaluated
N/A
NVD
CVE-2026-0045
EUVD
EUVD-2026-33776
Affected Vendors & Products
Currently, no data is known.
Helpful Resources
Exploitability
CWE
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KEV
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CWE ID Description
CWE-UNKNOWN
Attack-Flow Graph
AI Powered Q&A
Can you explain this vulnerability to me?

This vulnerability exists in the bta_jv_rfcomm_connect function of the bta_jv_act.cc file. It involves a logic error that allows a possible bypass of bonding for a secure connection.

Bonding is a security process that establishes trust between devices. The logic error means that this process can be bypassed, potentially allowing unauthorized access.


How can this vulnerability impact me? :

This vulnerability could lead to a local escalation of privilege without requiring any additional execution privileges or user interaction.

An attacker with local access could exploit this flaw to gain higher privileges on the affected system.


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